I can see in your thermal camera photos that the hottest area is the center of the upper side… I think that If I put there an active or passive heatsink for M.2 disk with big efficiency that heat wil be evacuated easily.
I cannot see the bottom side… may be possible to get a thermal photo of that? Nevertheless I think that Revopoint engineers are enought intelligent to situate the more heat generation components near of the upper side because it is what is more free of obstructions in most situations.
According to PopUpTheVolume
Only the March 2022 POP2’s have this heat issue, current POP2’s have a different circuit board and don’t have the heat issue.
How can I know if my unit is from March 2022 or is of later manufacture?
As I can see in your photos all the processing chips are in a board near of the upper side. Because of that the center of the upper side shows as the more heated area in thermal photos that you sent me.
But… As I can see in the photo made from right side there is a thick aluminium sheet between upper board and intermediate board and that is likely to be interpreted as a heatsink to evacuate heat from a component sited in the intermediate board.
On the other hand if that aluminium sheet was important for heat evacuation it should be fixed to a metallic part of the case for evacuate heat to outside such as rear side… but rear side in made in plastic… because of that I think that is less important in the total heat extraction even if it’s important for heatsinking the intermediate board.
In conclusion I think that if we get evacuate heat from center area of upper side the unit will be safe of heat problems. The area covered for a M.2 heatsink, 80x25mm, may be enought if is complemented with a thermal silicone pad conveniently fixed to heatsink and scanner. I would choose a pasive heatsink to simplify the design.
